ITRI和杜邦联合揭开半导体材料实验室

台湾新竹，2021年1月25日-工业技术研究所（ITRI）和杜邦电子和成像杜邦公司今天在台湾新竹市庆祝一个新的半导体材料实验室落成。

杜邦公司建立这个实验室是为了与台湾的半导体行业保持密切联系。杜邦将与国际半导体研究所合作，进行半导体材料的研究、开发和改进，并加快试点测试和商业可行性，以支持杜邦的客户在台湾追求下一代半导体。

5G和人工智能(AI)的发展推动了下一代半导体关键技术的发展，包括支持异构集成的材料、先进制造工艺、高端封装等。台湾在半导体产业中处于领先地位，拥有完整的半导体供应链。

Dr Chih-I Wu, VP and General Director of ITRI’s Electronic and Optoelectronic System Research Laboratories, stressed that ITRI has long invested in semiconductor research and development and has a solid foundation in the fields of electronics and optoelectronics, advanced packaging processes, chemistry and materials. With the support from AI on Chip Program of Department of Industrial Technology (DoIT), Ministry of Economic Affairs (MOEA), ITRI will expand investment in advanced equipment and technology, heterogeneous integrated packaging experiment platforms and diversified design, manufacturing processes and prototype production services. “Bringing together ITRI’s semiconductor-related technical strength and DuPont’s expertise in materials, this laboratory in ITRI’s vicinity will enable closer exchanges between the two organizations to bring more innovative solutions and meet the immediate needs of Taiwan’s semiconductor and IC substrate industries,” he said.

“杜邦一直在台湾开展业务50多年来，凭借台湾的工业发展，特别是在电子行业。我们对台湾的半导体技术和制造中心的投资是我们在亚太地区的枢纽，以促进全球先进的半导体技术，“杜邦台湾总统陈尼斯陈说。“多年来，我们努力加强技术突破，终端应用，支持台湾战略技术路线图。该实验室的就职典礼标志着我们继续加强台湾的创新和研发能力的另一个重要里程碑。“

杜邦高级封装技术（Dupont Advanced Packaging Technologies）增加了Rob Kavanagh，“杜邦致力于开发先进材料，以支持越来越复杂的包装技术。我们从我们过去的与ITRI合作中看到了积极的结果，并期待进一步利用每个合作other’s competencies and experience for our customers and Taiwan’s semiconductor industry.”